10 years experience on PCB Assembly;FR4, CEM1, CEM3, FR1, FR2, FR5, Ceramics;400mm*400mm dimension;0.4-5mm thickness;minimum gap between pad stack: 0.65mm;2-25 multilayer;Lead free, Rohs, CE;Brendnew...
As the product show in the figure, we can provide 3D-design, mock-up, final product and etc. If you have any question, please don't hesitate to contact...
digital products innovation, design, development and OEM / ODM supplier, and is invested by an international investment group. We have a very professional R/D team with about 30 engineering and...
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